About this opportunity
Intel Corporation lists this 3DIC Wet & Plating Tech Lead for Advanced Packaging opportunity in hillsboro, Oregon. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Intel Foundry is seeking a Wet and Plating Module Development Manager to lead Wet Etch/Clean and Plating technology development for 3DIC platforms. This role manages a team of process engineers while contributing technically to process optimization.
The successful candidate will shape the technology roadmap, drive production-ready processes for high-volume manufacturing, and collaborate across functions to enable manufacturing excellence and seamless technology transfer.
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Worksite address
hillsboro, OR, 97104, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.