About this opportunity
GPD Optoelectronics lists this Assembly Technician - Wire Bonder opportunity in salem, New Hampshire. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Assembly Technician, Wire BonderThe skilled Assembly Technician, specializing in wire bonding, supports production operations by performing wire bonding, assembly, inspection, and basic electrical testing of chips / die mounted to ceramic substrates and / or packages such as TO cans and LCCs. The Assembly Technician: Wire Bonder works as part of a production team reporting to Operations, while collaborating closely with Engineering and Quality to meet product, process, and customer requirements.This full-time, non-exempt role will be located in Salem, NH and will report to the Director of Operations.Key ResponsibilitiesAssembly & Wire BondingPerform manual and semi automated wire bonding of chips and die to ceramic substrates and packages (e.g., TO can, LCC) using various gauges of wirePrep material. Set up, and operate wire bond equipment per approved work instructions and travelersHandle optoelectronic devices using proper ESD, cleanliness, and contamination (FOD) control techniquesSupport engineering builds, process development, and continuous improvement activities, as neededInspection, Testing & QualityConduct visual inspection of assemblies under microscope to applicable MIL STD-883 workmanship criteriaPerform basic electrical "go / no go" and at times more advanced testing using standard test fixtures and equipmentIdentify, document, and report nonconforming material or process issuesMaintain accurate production records, travelers, and inspection results using our ERP system and shop floor interfaceHandling, Packaging & WorkflowPackage finished assemblies per work instructions and cleanliness requirementsMaintain material traceability and proper part identification throughout the processFollow cleanroom protocols, including gowning, tool control, and housekeeping standardsWork effectively within a team environment to meet production schedules and quality goalsQualifications & SkillsPrior experience in microelectronics or optoelectronic assembly preferred (wire bonding experience highly desired). Ability to work under a microscope and handle small, delicate components. Familiarity with ESD controls, cleanroom practices, and regulated manufacturing environments. Strong attention to detail, good manual dexterity, and ability to follow detailed instructions. This position may require sitting for long periods at a microscope, bending, reaching, visual acuity for inspection, and lifting up to 30 lbs.Able to lift 20 lbs. These activities are performed in a clean room environment which is temperature and humidity controlled. This position requires you to wear complete fab attire for an entire shift and meet all safety and cleanroom requirements which can include: Hand Hygiene, Personal Item Removal, Gowning Area Preparation, Order of Gowning, Shoe Covers, Hair Covers, Face Masks, Coveralls/Gowns, Gloves, Additional Garments, Final Inspection and maintaining proper protocols.GPD provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, transfer, leaves of absence, compensation and training.
Worksite address
salem, NH, 03079, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.