About this opportunity
Raytheon lists this Associate Director, 3D Microelectronics Packaging opportunity in tewksbury, Massachusetts. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Raytheon Advanced Technology in the United States is seeking a multi-disciplinary Engineering Project Leader to drive the strategy and development of a microelectronics packaging portfolio, including 2.5D and 3D heterogeneous integration to increase RF and mixed-signal density.
The role will guide program capture and CRAD execution, coordinate IRAD projects across programs, mentor engineers, manage budgets, and support transitions to operations.
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Worksite address
tewksbury, MA, 01876, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.