Boyd Thermal by Eaton Junior Thermal Research Engineer

Job description

Job Description

Junior Thermal Research Engineer is responsible for supporting the design, modeling, and experimental validation of advanced thermal management systems for next-generation electronics cooling applications in data center, semiconductor test and aerospace and defense applications. This role emphasizes thermal-fluid system modeling, data-driven engineering, and product development to accelerate design, optimization, and system-level performance prediction.

General Responsibilities

Support the design and development of thermal management systems, including liquid cooling, two-phase cooling, and heat exchanger-based architectures

Cooling system design including cold plates, cooling distribution units (CDUs) and passive two-phase solutions (heat pipes and vapor chambers)

Develop and apply thermal-fluid modeling tools (steady-state and transient) for system-level performance prediction, including pressure drop, heat transfer, and coolant distribution

Implement and use machine learning, AI and data-driven methods

Support data center cooling system modeling, including rack-level and component-level thermal architecture analysis

Conduct design of experiments (DOE) and support experimental testing, including instrumentation, data acquisition, and validation of models

Create and maintain CAD models and engineering documentation (e.g., SolidWorks designs, P&IDs, drawings, and test plans)

Assist in development of computational tools and simulation frameworks (Python, MATLAB) to support engineering decision-making and research activities

Support prototype development and testbed construction, including integration of thermal systems and measurement capabilities

Collaborate with senior engineers and researchers to:Evaluate new cooling technologies

Improve system efficiency and performance

Identify key design tradeoffs

Contribute to technical documentation, reports, and presentations of results

Additional Responsibilities

Support component and material selection for thermal systems (heat exchangers, sensors, cooling loops)

Assist in manufacturing and assembly support, including prototype builds and testing

Understand and evaluate trade-offs between cost, performance, and scalability

Participate in cross-functional collaboration with mechanical, electrical, and controls engineers

Experience / Qualifications

Master’s or PhD degree in Mechanical Engineering or related field

Focus or coursework in heat transfer, fluid dynamics, or thermal systems required

Laboratory experience

Graduate research experience in thermal-fluid sciences or cooling technologies strongly preferred

Technical Skills

Thermal & Fluid Systems: Two-phase cooling, electronics cooling, refrigeration/HVAC systems, Heat exchanger design, boiling/condensation heat transfer

Modeling & Simulation: ANSYS (Fluent, Icepak, Mechanical) or similar CFD tools, System-level thermal-fluid modeling

Data Science & Optimization: Machine learning surrogate modeling, Data-driven engineering approaches

Programming: Python and/or MATLAB for modeling, simulation, and data analysis, LabVIEW

Experimental Methods: DOE, instrumentation, DAQ, and experimental validation

Communications: Strong communications skills to facilitate knowledge sharing

Preferred Experience

Exposure to data center cooling or high-performance electronics thermal management

Experience developing reduced-order or surrogate models for thermal systems

Familiarity with optimization-driven design workflows

Experience integrating modeling and experimental validation

Compliance & Eligibility

All positions require use of information or access to hardware which is subject to the International Traffic in Arms regulations. All applicants must be U.S. Persons within the meaning of ITAR. ITAR defines a U.S. Person as a U.S. Citizen, U.S. Permanent Resident, Political Asylee, or Refugee.

Eaton will not consider applicants for employment immigration sponsorship or support for this position. This means that Eaton will not support any CPT, OPT, or STEM OPT plans, F-1 to H-1B, H-1B cap registration, O-1, E-3, TN status, I-485 job portability, etc.

Candidate will not need sponsorship now or in the future.

No relocation benefit is being offered for this position. Only candidates that currently reside within the immediate geographical area (50 miles/80 kilometers) of the {Location} facility will be considered.

Additional Information

Travel may be required up to 10% of the time

Opportunity to gain exposure to and work with many cross functional teams

Exposure to senior leaders within the Electrical Sector businesses – (leadership level/senior level roles only)

EEO Statement Boyd Corp is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. Boyd is the trusted global innovator of sustainable solutions that make our customers’ products better, safer, faster, and more reliable. As a leader in the industry we focus on our people, customers, technology, innovation, materials, and market needs of today and performance requirements of the future. We are always looking for ambitious minds to help us deliver advanced technology to our customers. Together we solve the challenges of today and empower solutions of tomorrow. Boyd is the world’s leading innovator in sustainable engineered material that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years.

All Job Posting Locations: Laconia. Remote Type: On-Site.

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Worksite address

laconia, NH, 03246, US

Who can apply

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