About this opportunity
Boyd Corporation lists this Boyd Thermal by Eaton Junior Thermal Research Engineer opportunity in northern, Kentucky. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Job Description
Junior Thermal Research Engineer is responsible for supporting the design, modeling, and experimental validation of advanced thermal management systems for next-generation electronics cooling applications in data center, semiconductor test and aerospace and defense applications. This role emphasizes thermal-fluid system modeling, data-driven engineering, and product development to accelerate design, optimization, and system-level performance prediction.
General Responsibilities
Support the design and development of thermal management systems, including liquid cooling, two-phase cooling, and heat exchanger-based architectures
Cooling system design including cold plates, cooling distribution units (CDUs) and passive two-phase solutions (heat pipes and vapor chambers)
Develop and apply thermal-fluid modeling tools (steady-state and transient) for system-level performance prediction, including pressure drop, heat transfer, and coolant distribution
Implement and use machine learning, AI and data-driven methods
Support data center cooling system modeling, including rack-level and component-level thermal architecture analysis
Conduct design of experiments (DOE) and support experimental testing, including instrumentation, data acquisition, and validation of models
Create and maintain CAD models and engineering documentation (e.g., SolidWorks designs, P&IDs, drawings, and test plans)
Assist in development of computational tools and simulation frameworks (Python, MATLAB) to support engineering decision-making and research activities
Support prototype development and testbed construction, including integration of thermal systems and measurement capabilities
Collaborate with senior engineers and researchers to:Evaluate new cooling technologies
Improve system efficiency and performance
Identify key design tradeoffs
Contribute to technical documentation, reports, and presentations of results
Additional Responsibilities
Support component and material selection for thermal systems (heat exchangers, sensors, cooling loops)
Assist in manufacturing and assembly support, including prototype builds and testing
Understand and evaluate trade-offs between cost, performance, and scalability
Participate in cross-functional collaboration with mechanical, electrical, and controls engineers
Experience / Qualifications
Master’s or PhD degree in Mechanical Engineering or related field
Focus or coursework in heat transfer, fluid dynamics, or thermal systems required
Laboratory experience
Graduate research experience in thermal-fluid sciences or cooling technologies strongly preferred
Technical Skills
Thermal & Fluid Systems: Two-phase cooling, electronics cooling, refrigeration/HVAC systems, Heat exchanger design, boiling/condensation heat transfer
Modeling & Simulation: ANSYS (Fluent, Icepak, Mechanical) or similar CFD tools, System-level thermal-fluid modeling
Data Science & Optimization: Machine learning surrogate modeling, Data-driven engineering approaches
Programming: Python and/or MATLAB for modeling, simulation, and data analysis, LabVIEW
Experimental Methods: DOE, instrumentation, DAQ, and experimental validation
Communications: Strong communications skills to facilitate knowledge sharing
Preferred Experience
Exposure to data center cooling or high-performance electronics thermal management
Experience developing reduced-order or surrogate models for thermal systems
Familiarity with optimization-driven design workflows
Experience integrating modeling and experimental validation
Compliance & Eligibility
All positions require use of information or access to hardware which is subject to the International Traffic in Arms regulations. All applicants must be U.S. Persons within the meaning of ITAR. ITAR defines a U.S. Person as a U.S. Citizen, U.S. Permanent Resident, Political Asylee, or Refugee.
Eaton will not consider applicants for employment immigration sponsorship or support for this position. This means that Eaton will not support any CPT, OPT, or STEM OPT plans, F-1 to H-1B, H-1B cap registration, O-1, E-3, TN status, I-485 job portability, etc.
Candidate will not need sponsorship now or in the future.
No relocation benefit is being offered for this position. Only candidates that currently reside within the immediate geographical area (50 miles/80 kilometers) of the {Location} facility will be considered.
Additional Information
Travel may be required up to 10% of the time
Opportunity to gain exposure to and work with many cross functional teams
Exposure to senior leaders within the Electrical Sector businesses – (leadership level/senior level roles only)
EEO Statement Boyd Corp is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. Boyd is the trusted global innovator of sustainable solutions that make our customers’ products better, safer, faster, and more reliable. As a leader in the industry we focus on our people, customers, technology, innovation, materials, and market needs of today and performance requirements of the future. We are always looking for ambitious minds to help us deliver advanced technology to our customers. Together we solve the challenges of today and empower solutions of tomorrow. Boyd is the world’s leading innovator in sustainable engineered material that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years.
All Job Posting Locations: Laconia. Remote Type: On-Site.
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Who can apply
Review the original listing for work authorization, qualifications and employer requirements.