About this opportunity
Samsung Electronics Perú lists this C2C Bonding Engineer: BEOL Module Integration Lead opportunity in austin, Texas. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Samsung Austin Semiconductor seeks a Copper-to-Copper bonding expert to lead development, optimization, and manufacturing integration of advanced wafer bonding technologies for next-generation CIS applications.
You will drive innovations in hybrid bonding to enable stacked image sensors with superior yield, performance, and reliability, while coordinating with fab teams on process changes and risk assessment.
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Worksite address
austin, TX, 78716, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.