About this opportunity
Advanced Micro Devices, Inc. lists this Data Center Packaging Engineering Lead opportunity in santa clara, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Advanced Micro Devices, Inc. is seeking a experienced leader to drive end-to-end Data Center GPU and MI package design programs. You will lead cross-functional teams across design, SI/PI, and manufacturing to ensure timely, high-quality package solutions.
You will mentor and grow a high-performing team, foster accountability and innovation, and partner with OSATs and vendors to optimize yield and manufacturability. This role emphasizes leadership, collaboration, and data-driven decision making.
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Worksite address
santa clara, CA, 95053, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.