About this opportunity
Micron Technology, Inc lists this Die Bonding Process Engineering Lead opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology, Inc in Boise, Idaho is looking for a Principal Process Engineer to lead die bonding technology advancements. The ideal candidate should have a BS degree combined with at least 8 years of experience in semiconductor process engineering. Responsibilities include developing and optimizing processes, validating new technologies, and managing supplier relationships. Micron offers comprehensive benefits, including medical, paid leave, and a robust paid time-off program.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.