About this opportunity
Micron lists this Director, Advanced DRAM Packaging & Tech Strategy opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology seeks a Director of DRAM Packaging to lead strategy for the memory portfolio, define technology roadmaps, and build a high‑performing global engineering organization. This executive role combines technical depth with business insight to accelerate innovation and deliver industry‑leading packaging technologies.
You will guide long‑term packaging strategies, including HBM, LPDRAM, DDR, and 2.5D/3D integration, while partnering with design, manufacturing, quality, and customers to
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.