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Job description
Micron Technology in Boise seeks a Process Integration Lead for Advanced Packaging to guide a team developing and integrating 2.5D/3D packaging technologies from concept to manufacturing. You will drive technology transfer, design rules, and cross-functional collaboration to enable high-performance multi-die solutions.
You will mentor engineers, shape the roadmap for next-generation packaging platforms, and lead efforts in yield, reliability, and data-driven optimization across global teams.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.