About this opportunity
Amkor Technology, Inc. lists this Director, Advanced Packaging & Wafer Solutions opportunity in tempe, Arizona. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Amkor Technology, Inc., the world’s largest U.S.-headquartered OSAT, seeks a Senior Director of Advanced Packaging and Wafer Services for Tempe, AZ. You will provide strategic leadership for advanced wafer-based IC packages, including 2.5D and chiplet architectures, and interface with Tier 1 customers, global R&D centers, and cross-functional teams to drive roadmaps and production ramp.
You will lead cross-functional teams across R&D, design, characterization, and operations, guiding technical
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Worksite address
tempe, AZ, 85285, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.