About this opportunity
Qualcomm lists this Director, IC Packaging Simulation & Engineering opportunity in san diego, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Qualcomm is seeking a Director to lead the Mechanical Simulation function in San Diego, California. This senior leadership role involves delivering mechanical simulation solutions to support chipsets and packaging technologies.
The ideal candidate will have substantial experience in FEA modeling and significant people management skills, overseeing engineering teams and driving strategic initiatives. Competitive salary, annual bonus and RSU grants available.
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Worksite address
san diego, CA, 92189, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.