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Job description
Ciena is seeking an Optoelectronic IC Package Design Director to lead the xPO engineering team and drive advanced package development for custom in-house photonic, analog, and digital ICs, enabling next-gen optical modules.
You will own package selection, scheduling, SI/PI optimization, and work with cross-functional groups to optimize silicon floor plans and tapeouts, with a focus on RF performance and manufacturing readiness.
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Worksite address
new providence, NJ, 07974, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.