About this opportunity
Steneg lists this Director of Quantum Packaging Engineering opportunity in boulder, Colorado. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Steneg is pursuing a Head of Packaging Engineering to lead architecture and development of advanced semiconductor packaging for next-generation ion trap devices. The role partners with physicists, engineers and external suppliers to define long-term roadmaps balancing leadership and hands-on contribution.
The candidate will guide mechanical, thermal, electrical and photonic packaging interfaces, ensuring manufacturability, reliability and system-level performance in a highly collaborative,
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Worksite address
boulder, CO, 80301, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.