About this opportunity
Amkor Technology, Inc. lists this Director, Package Development opportunity in tempe, Arizona. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com.
Position Summary
Amkor is seeking a senior Director of Advanced Packaging and Wafer Services for the Tempe, AZ office. This role will provide strategic and technical leadership for the development and commercialization of advanced wafer-based IC package platforms, including HDFO, 2.5D, chiplet-based architectures, and other leading-edge package constructions for computing, networking, AI, and mobile market segments. The successful candidate will serve as a senior customer-facing leader and primary interface with Tier 1 customers, Amkor's global R&D centers, and cross-functional business and engineering teams to drive technology roadmaps, program execution, and successful transition from development into production ramp.
Essential Duties And Responsibilities
Lead strategic customer engagements and development programs with Tier 1 customers, aligning customer requirements with Amkor's advanced packaging technology roadmap.
Drive and coordinate development activities with Amkor's R&D teams in Korea and other global engineering organizations to ensure timely execution of advanced package programs.
Serve as the senior technical and program interface for customer meetings, executive reviews, technical discussions, issue resolution, and follow-up actions during the development and qualification phases.
Lead cross-functional teams across R&D, design, characterization, simulation, process engineering, product management, operations, suppliers, and business development to execute complex advanced packaging programs.
Own customer product management through concept definition, feasibility assessment, development, qualification, and initial production ramp.
Guide technical tradeoff decisions related to package architecture, wafer process integration, design rules, materials, reliability, manufacturability, cost, schedule, and yield risk.
Lead key engagements with ecosystem partners and wafer processing suppliers to influence technology choices, supplier readiness, and future roadmap direction.
Required Qualifications
Bachelor's degree in Engineering required; Master's degree or Ph.D. preferred.
10+ years of experience in semiconductor package development, wafer-level packaging, IC packaging, or wafer process technology.
Demonstrated leadership in advanced packaging development programs, including direct customer engagement with major semiconductor, computing, networking, AI, or mobile customers.
Strong technical understanding of IC package architecture, package design environments, wafer process integration, design-rule tradeoffs, and manufacturability considerations.
Working knowledge of IC packaging materials, failure modes, reliability qualification, process characterization, and production ramp requirements.
Proven ability to lead cross-functional and global teams, influence technical and business stakeholders, and drive alignment across customers, engineering, operations, suppliers, and executive leadership.
Excellent written and verbal communication skills, including the ability to present complex technical and business topics to senior customer and internal leadership.
This position requires 10-20% domestic and international travel.
Preferred Qualifications
Deep expertise in high-density fan-out, 2.5D integration, chiplet module architectures, bridge-like constructions, advanced substrate technologies, or heterogeneous integration.
Experience taking advanced package technologies from concept through qualification and early production ramp.
Familiarity with cost modeling, yield improvement, design-for-manufacturing, and technology roadmap planning.
Experience working with global R&D teams, OSAT operations, foundries, fabless semiconductor companies, or major system customers.
Location
Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.
Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.
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Worksite address
tempe, AZ, 85285, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.