About this opportunity
Micron Technology, Inc lists this Director, Technical Package Development opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Director, Technical Package Development
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Summary
The DRAM Packaging organization is responsible for developing and delivering advanced memory packaging solutions that enable Micron’s next generation products. The team partners across design, technology development, manufacturing, quality, supply chain, and external ecosystem partners to drive innovation, accelerate product development, and deliver industry-leading packaging technologies that support markets including AI, cloud, mobile, automotive, high-performance computing, and data centers!
Position Overview
As the Director of DRAM Packaging, you will lead the strategy, development, and execution of advanced packaging solutions across Micron's memory portfolio. You will define technology roadmaps, drive innovation in next-generation packaging architectures, and build a high-performing global engineering organization. This executive leadership role combines technical expertise, business strategy, customer engagement, and digital transformation to accelerate innovation, improve organizational effectiveness, and strengthen Micron’s competitive position.
Responsibilities
Define and execute long-term DRAM packaging strategies that support future product, technology, and business objectives
Lead development and deployment of advanced packaging technologies, including HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets, and next-generation interconnect solutions
Drive adoption of AI, machine learning, advanced analytics, and digital engineering approaches to improve product development, manufacturing, and engineering productivity
Build, develop, and lead a global packaging organization focused on innovation, technical excellence, accountability, and operational execution
Partner with design, product engineering, manufacturing, quality, supply chain, and technology development teams to deliver successful products from concept through high-volume manufacturing
Establish and maintain strategic relationships with customers, OSAT partners, foundries, suppliers, equipment vendors, and research institutions
Lead technology investment decisions through driven benchmarking, cost analysis, risk assessment, and case development
Drive organizational performance through scalable engineering processes, automation, knowledge management, and data-driven decision making
Minimum Qualifications
Bachelor’s degree in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field
15+ years of semiconductor packaging experience, including delivery of advanced packaging technologies from development through high-volume manufacturing
10+ years of experience leading engineering teams, complex technology programs, or global engineering organizations
Demonstrated expertise in advanced packaging technologies, including HBM, LPDRAM, DDR, 3D stacking, heterogeneous integration, or related platforms
Proven experience driving business-critical technology decisions through technical analysis, risk assessment, and multi-functional collaboration
Preferred Qualifications
Master’s degree or PhD in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field
Experience implementing AI, machine learning, advanced analytics, or digital engineering solutions to improve engineering, manufacturing, or business outcomesExperience leading digital transformation initiatives involving automation, data science, and engineering productivity improvements
Strong executive communication and customer engagement skills, with experience representing an organization at industry forums, customer meetings, or technical conferences
Demonstrated record of innovation through patents, industry publications, conference presentations, or other recognized technical contributions
Experience developing future technology roadmaps and influencing strategic direction across engineering and business organizations
Proven success building high-performing teams, mentoring leaders, and driving a culture of continuous improvement and innovation
Experience and/or interest in developing Agentic AI workflows into current or future processes.
Job Profile(s):
Product Development Manager 3
Relocation Level: TBD
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.