About this opportunity
Distro lists this Electromechanical Engineer opportunity in bedford, Massachusetts. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Electromechanical Engineer Bedford, MA $97,000 ‒ $149,000 Annually Photonics Electromechanical Engineer
Department~ Photonics Division
Location~ Bedford, MA (On-site)
Reports To~ Engineering Manager
Employment Type~ Full-time
About The Role
QCi is seeking an Electromechanical Engineer to develop and integrate advanced electro-optic (EO), opto- electronic (OE), RF, and photonic (SiPh/PIC) modules. This role focuses on electromechanical integration, ensuring that electrical structures, interconnects, thermal systems, and mechanical packaging are combined into reliable, manufacturable products.
The successful candidate will work across the full product lifecycle—from concept development and CAD design through prototyping, characterization, qualification, and manufacturing transfer. This is a highly hands‑on role for an engineer who enjoys solving multidisciplinary engineering challenges and working closely with product development and manufacturing teams.
What You’ll Do
Electromechanical Integration & Design
Own the electromechanical integration and packaging of EO, OE, photonic, and RF modules, including electrical structures, interconnects, thermal systems, packaging, and enclosure design. Design and integrate transmission lines, interposers, PCBs, connectors, flex circuits, wire/ribbon bonds, and related interconnect technologies. Co‑design electrical layouts and mechanical housings to ensure proper fit, alignment, thermal performance, manufacturability, reliability, and signal integrity. Specify and integrate TECs, thermistors, drivers, and control electronics while supporting power budgeting and thermal management. Design fixtures, tooling, and support hardware for assembly, testing, and qualification activities.
Testing & Characterization
Develop and execute electrical test plans, including continuity, functional, and S‑parameter characterization. Develop data acquisition, automation, and analysis tools using Python or similar scripting languages. Build and qualify test fixtures, jigs, and automated measurement systems. Support hardware troubleshooting, root‑cause investigations, and corrective actions.
Manufacturing & Productization
Build and maintain component libraries using distributor data from Digi‑Key, Mouser, and other approved suppliers. Author assembly procedures, work instructions, and engineering documentation. Collaborate with manufacturing and suppliers to improve yield, reliability, cost, and manufacturability. Support qualification efforts to standards such as MIL‑STD‑883, Telcordia GR‑468, and related reliability requirements. Drive successful transfer of designs from prototype development into manufacturing, including process documentation, design‑for‑manufacturing (DFM), yield improvement, and production support.
Required Qualifications
B.S. in Electrical Engineering, Mechanical Engineering, Electromechanical Engineering, or a related engineering discipline.
2+ years of relevant industry experience in electromechanical product development.
Experience integrating PCBs, interconnects, packaging, and mechanical structures into manufacturable hardware.
Experience with PCB design and layout using industry-standard EDA tools such as Altium Designer, KiCad, OrCAD, or equivalent.
Proficiency with SolidWorks or equivalent 3D CAD software.
Proficiency in Python or similar tools for automation, data analysis, and process control.
Experience creating and maintaining component libraries, including footprints, symbols, sourcing information, and lifecycle management.
Hands‑on laboratory experience with hardware assembly, troubleshooting, testing, and characterization.
Demonstrated ability to solve multidisciplinary engineering problems involving electrical, mechanical, thermal, and manufacturing constraints.
Preferred Qualifications
Experience with RF and microwave characterization, measurement, and high‑frequency interconnect design.
Familiarity with controlled‑impedance design, S‑parameters, VNA measurements, and signal‑integrity considerations.
Familiarity with HFSS, CST, or similar electromagnetic simulation tools.
Experience packaging EO, OE, RF, or photonic modules, including die attach, wire/ribbon bonding, hermetic sealing, laser welding, or fiber attachment.
Experience with qualification testing and reliability standards.
Experience with aerospace, defense, telecommunications, or other high‑reliability industries.
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Worksite address
bedford, MA, 01730, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.