About this opportunity
Raytheon lists this Engineering Lead — Microelectronics Packaging (2.5D/3D) opportunity in goleta, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Raytheon Technologies, Advanced Technology sector, seeks an Engineering Project Leader to drive strategy and development of a microelectronics packaging portfolio, including 2.5D and 3D heterogeneous integration. You will guide CRAD programs, craft proposals, and collaborate across Raytheon to mature concepts into programs.
This onsite role supports multiple locations including Goleta, CA, and requires Top Secret clearance.
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Worksite address
goleta, CA, 93116, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.