This job is closed
Applications are no longer available for this announcement. Explore current related opportunities below.
Job description
IBM Research invites applications for Hardware Intern 2027: Advanced Solder Processes, Yorktown Heights, NY. This internship focuses on studying bonding and reflow techniques with relevance to high-performance computing.
Ideal candidates have a High School Diploma or GED, with preferred Bachelor's degree and strong SMT soldering knowledge. The role emphasizes teamwork, data analysis, and a drive to learn new soldering innovations.
#J-18808-Ljbffr
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.