About this opportunity
Micron Technology, Inc lists this HBM Design Engineering Program Lead opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
A leading semiconductor company in Boise is seeking a Sr Manager Design Engineering to oversee the execution of high bandwidth memory (HBM) projects. The ideal candidate will have a Bachelor's in Electrical Engineering and significant experience leading technical programs. Responsibilities include managing project timelines, coordinating with internal teams and external partners, and ensuring adherence to design standards. The position offers competitive benefits, including healthcare plans and generous PTO.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.