About this opportunity
1000 Micron Technology, Inc. lists this HBM SoC Physical Design Engineer Intern opportunity in folsom, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology, Inc. is seeking a SoC Physical Design Intern on the HBM team in the United States.
You will support the implementation of advanced HBM SoC designs and gain hands-on experience in physical design methodologies, timing analysis, signoff flows, and automation. You will work with veterans across architecture, RTL, verification, DFT, and signoff, contributing to next-generation memory products for AI, HPC, and data centers.
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Worksite address
folsom, CA, 95630, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.