About this opportunity
PR Photonics AI lists this High Speed EIC Design Engineer opportunity in princeton, New Jersey. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Company Description PR Photonics develops advanced silicon-photonics technologies for next-generation AI and high-performance computing infrastructure. Our work focuses on high-bandwidth, low-power optical interconnects and co-packaged optical (CPO) engines integrating silicon photonic devices with advanced electronic integrated circuits.
We are seeking a High-Speed EIC Design Engineer to develop the electronic integrated circuits that interface directly with our silicon-photonics platforms. The engineer will work closely with our photonics, packaging, test, and system teams on tightly integrated EIC/PIC optical engines.
Responsibilities
· Design high-speed analog and mixed-signal ICs for silicon-photonics optical transceivers and CPO optical engines.
· Develop high-speed modulator drivers for microring resonator (MRR) and other silicon-photonic modulators.
· Design receiver front ends including TIA, limiting amplifier, and related high-speed analog circuitry.
· Develop circuits supporting NRZ and PAM4 signaling, targeting 100–200+ Gb/s electrical/optical lanes.
· Design low-power bias, control, monitoring, DAC/ADC interface, and calibration circuits for photonic devices.
· Develop electronics for wavelength tuning, stabilization, and control.
· Perform EIC/PIC co-design to optimize bandwidth, power consumption, signal integrity, noise, and overall link performance.
· Model electrical parasitics associated with EIC-to-PIC interconnects, including wire bonds, micro-bumps, interposers, and advanced packaging.
· Perform schematic design, simulation, layout supervision, extraction, and post-layout verification.
· Conduct high-speed signal-integrity and power-integrity analysis.
· Support IC tapeout, bring-up, characterization, debugging, and performance optimization.
· Work with silicon-photonics designers to define electrical interfaces and optimize the photonic devices and electronics as a combined system.
· Collaborate with packaging engineers on tightly integrated EIC/PIC architectures for optical engines.
· Develop test methods and analyze measured high-speed electrical and optical data.
· Document designs, simulation results, design reviews, and silicon characterization.
Qualifications Required
· PhD or M.S. in Electrical Engineering, Microelectronics, Integrated Circuits, or a closely related field.
· Strong background in high-speed analog, RF, or mixed-signal IC design.
· Experience designing circuits in advanced CMOS, SOI, or SiGe BiCMOS technologies.
· Strong understanding of transistor-level analog/RF design and high-frequency circuit behavior.
· Experience with high-speed circuit simulation, layout, parasitic extraction, and post-layout verification.
· Understanding of transmission lines, impedance matching, signal integrity, jitter, noise, and high-speed I/O.
· Experience with industry-standard IC design tools such as Cadence Virtuoso, Spectre, and related verification/extraction tools.
· Ability to work closely with photonics, packaging, and test engineers in a multidisciplinary development environment.
Preferred
· Direct experience with silicon-photonics EIC/PIC co-design.
· Experience designing drivers for Mach-Zehnder and/or MRR modulators.
· Experience designing high-speed TIAs and optical receiver front ends.
· Experience with 100G/200G-per-lane NRZ or PAM4 architectures.
· Experience with low-power optical interconnects, CPO, or optical I/O.
· Familiarity with microring resonance control, wavelength locking, thermal tuning, and feedback control.
· Experience with SerDes, CDR, equalization, FFE/DFE, or clocking circuits.
· Experience with advanced packaging, 2.5D/3D integration, flip-chip, micro-bumps, or EIC/PIC co-packaging.
· Hands-on experience characterizing high-speed ICs using oscilloscopes, VNAs, BERTs, probe stations, and optical test equipment.
· Experience taking high-speed analog or mixed-signal ICs from architecture through tapeout and silicon validation.
Ideal Candidate
The ideal candidate combines strong transistor-level high-speed IC design expertise with an understanding of optical communication systems. You should be comfortable treating the EIC, photonic IC, package, and optical link as a single system rather than independently optimized components.
This position offers the opportunity to develop extremely low-power, high-bandwidth electronic-photonic interfaces for next-generation AI computing and data-center optical connectivity.
Compensation
Base Salary: $120,000 – $200,000
In addition, eligible employees may receive: stock option grants, performance-based bonuses, comprehensive benefits package, and career growth opportunities
Why Join PR Photonics?
Help build breakthrough technologies for AI infrastructure
Direct impact on product and technology direction
Meaningful equity participation
Collaborative startup environment
Opportunity to work alongside world-class photonics engineers\
Contact:
PR Photonics is an Equal Opportunity Employer.
Worksite address
princeton, NJ, 08544, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.