About this opportunity
Renesas Electronics Corporation lists this Lead, Advanced Package Design Engineer (Hybrid) opportunity in austin, Texas. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Renesas Electronics Corporation is seeking a Principal Package Design Engineer to lead development and integration of next-generation packaging solutions for high-performance semiconductors. The role emphasizes advanced package architecture, simulation, OSAT strategy, cross-functional collaboration, and qualification from concept to high-volume production.
The ideal candidate has extensive experience in semiconductor packaging, strong CAD/simulation skills, and a track record of delivering
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Worksite address
austin, TX, 78716, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.