About this opportunity
Micron Technology, Inc lists this Lead Die Bonding Process Engineer – Yield & Innovation opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology, Inc is seeking a Principal Process Engineer to enhance die bonding processes and improve product quality and reliability. This role focuses on optimizing production methods and resolving manufacturing issues while collaborating with suppliers and conducting internal audits.
The ideal candidate will have at least 8 years of semiconductor experience, a BS degree in a relevant field, and strong communication skills. Benefits include medical, dental, and vision plans as well as generous paid time off.
#J-18808-Ljbffr
Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.