About this opportunity
Bradycorp lists this Lead Firmware Engineer opportunity in milwaukee, Wisconsin. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Brady Corporation is seeking a Lead Firmware Engineer to join our team in developing high speed inkjet and thermal transfer printing systems. The position is responsible for designing, implementing, and testing real-time embedded firmware to enhance the performance and functionality of our printing systems. The Lead Firmware Engineer will be successful in this position by leveraging their expertise in embedded firmware design to deliver high-quality, reliable solutions that meet product requirements, while collaborating effectively with cross-functional teams, and continuously driving innovation and improvements in our printing systems.
Lead team to design, develop, code, and document entire systems within a large firmware project.
Design, develop, and implement firmware in modern C++ for embedded systems within our printing solutions.
Develop and maintain Linux and real-time operating system (RTOS) based firmware for resource-constrained environments.
Analyze and solve problems using debuggers, logic analyzers, oscilloscopes, and other tools
Read schematics and datasheets necessary to write low-level firmware
Collaborate effectively with electrical engineers, mechanical engineers, and software developers to integrate firmware with hardware and software components.
Perform code reviews to ensure adherence to coding standards and best practices.
Deconstruct complex, high-level features into technical requirements and actionable tasks, lead team in establishing accurate effort estimations
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Worksite address
milwaukee, WI, 53244, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.