About this opportunity
Lockheed Martin lists this Lead Hardware Engineering Manager - Electronics Packaging opportunity in moorestown township, New Jersey. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Lockheed Martin is seeking a First Line Manager for the Electronics Packaging group within the Sensors mechanical Design and Test organization. You will lead a team of about 20 engineers, drive hardware development processes, and oversee radar packaging designs to meet customer contracts and company standards.
The role requires a bachelor’s in mechanical engineering or related field, with extensive experience in electronics packaging, and the ability to obtain a SECRET clearance.
#J-18808-Ljbffr
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.