About this opportunity
Apple Inc. lists this Lead IC Packaging & Integration Engineer opportunity in san francisco, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Apple Inc. in the San Francisco Bay Area seeks an IC Packaging Engineering Lead to drive package integration and architecture with cross-functional Silicon, Packaging, and Systems teams.
You will shepherd packaging concepts from development through high-volume manufacturing, collaborating with OSATs and assembly partners to deliver cost‑effective, high-performance solutions. The role requires a strong technical foundation in semiconductor packaging, a track record of delivering complex packages,
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Worksite address
san francisco, CA, 94199, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.