About this opportunity
GlobalFoundries inc. lists this Lead Optical Packaging Engineer (SiPh & CPO) opportunity in essex, Maryland. Review the employer’s description below for duties, qualifications and application requirements.
Job description
GlobalFoundries inc. is seeking a Packaging Integration Engineer to lead optical packaging architectures for silicon photonics modules, including fiber attach and photonic die placement. You will drive 2.5D/3D/3.5D HI packaging, work with OSATs, and optimize reliability through multiphysics simulations.
The role requires a Master’s degree and 8+ years in semiconductor packaging with strong communications skills. Travel up to 25% to GF facilities or partners is expected.
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Worksite address
essex, MD, 21221, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.