About this opportunity
Micron Technology, Inc. lists this Lead Package Architect: Advanced Packaging & System Exploration opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology, Inc. is seeking an experienced hands-on architecture engineer to define and explore advanced package architectures for future memory systems.
You will independently build models, run SI/PI and thermal simulations, and translate results into clear architectural guidance. Minimum qualifications include a Bachelor’s degree or equivalent with 10+ years in package design or simulation; strong SI modeling; preferred master’s degree and pre-silicon exploration experience.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.