About this opportunity
Apple Inc. lists this Lead Packaging Substrate Engineer — Roadmap & Innovation opportunity in san francisco, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
A leading technology company in San Francisco is seeking a senior professional to lead SoC package substrate technology development. The ideal candidate will have over 10 years of relevant experience and in-depth knowledge of substrate technology. Responsibilities include collaborating with industry partners and problem-solving throughout the product development cycle. This position offers competitive compensation, stock options, and comprehensive benefits.
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Worksite address
san francisco, CA, 94199, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.