About this opportunity
Fractile lists this Manufacturing Operations Technical Programme Manager – Silicon and Packaging opportunity in bristol, Virginia. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Manufacturing Operations Technical Programme Manager – Silicon and Packaging
Reporting into the Director of Programmes, the Manufacturing Operations Technical Programme Manager will manage the silicon production, packaging design, packaging manufacturing, and delivery flow through to our contract manufacturer.
This role will act as the key interface between Fractile, the foundry, OSAT partner and the internal operations team, ensuring that technical milestones, schedules, risks, and handoffs are tightly managed from wafer production through to packaged silicon delivery.
What You’ll Do
Hardware Programme Delivery
Own the end-to-end project plan from wafer production through packaged silicon delivery
Coordinate day-to-day activity with foundry, OSAT, packaging, logistics, and contract manufacturing partners.
Track milestones across wafer starts, fab progress, packaging, assembly, final test, qualification, and shipment.
Manage risks, dependencies, schedule changes, and timely issue resolution, working closely with team leads and programme managers for silicon, hardware systems and hardware test internally and external partners and suppliers
Ensure manufacturing documentation, test requirements, quality requirements, and build readiness materials are complete
Support NPI, prototype builds, qualification, and production ramp
Lead manufacturing operations programme reviews that surface risk early and clearly and contribute to overall programme portfolio reviews
In addition, you will contribute to the development of the Programmes Team:
Contribute to the design and rollout of scalable programme management practices across Fractile, covering planning, forecasting, reporting, risk and change control
Bring proven patterns from previous environments and adapt them to our development stage, pace and constraints rather than importing process for its own sake
Help establish shared tooling, templates and review cadences that work consistently across silicon, hardware, manufacturing and software workstreams
What We’re Looking For
Experience
5+ years in technical project management, operations, supply chain, or programme management in semiconductors or complex hardware
Experience working with foundries, OSATs, packaging suppliers, or contract manufacturers
Strong understanding of semiconductor production and packaging flows
Ability to manage complex schedules, multiple stakeholders, technical dependencies, supplier risks, and cross-functional execution.
Experience using tools such as Jira, Confluence, Linear, Asana, Smartsheet, MS Project or PLM systems
Experience working in a rapidly scaling organisation building process on the way
Experience in the following areas would be an advantage:
Advanced packaging, high-performance compute, chiplets, 2.5D/3D integration, or HBM-based packages.
Familiarity with silicon bring-up, NPI, qualification, yield tracking, and production ramp.
Working with Asian semiconductor supply chains and partners.
Leadership and Communication
Highly organised with strong prioritisation discipline
Structured thinker with rigorous risk management instincts
Clear, concise communicator able to operate confidently with both engineers and executives
Export control and security clearance
Certain roles may involve working on technologies subject to export restrictions. Applicants may be required to undergo additional eligibility checks to ensure compliance with applicable law.
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Worksite address
bristol, VA, 24202, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.