waypointjobs

Micron Technology Inc

Mechanical/Thermal Principal Design Engineer

boise junction, ID

Check who can apply and the requirements below before continuing.

This job is closed

Applications are no longer available for this announcement. Explore current related opportunities below.

Job description

Job Description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our team is at the forefront of developing next-generation memory and AI computing platforms. We are core contributors to the design, validation, and mass production of advanced systems using emerging memory technologies, ASICs, FPGAs, high-speed digital interfaces, mixed-signal and analog circuitry, and complex power delivery architectures!

We are seeking a highly experienced Mechanical & Thermal Engineer to provide technical leadership and drive the mechanical and thermal architecture of ground breaking hardware platforms. This role offers the opportunity to influence product strategy, lead critical engineering decisions, and collaborate across global multidisciplinary teams to enable world-class computing solutions.

The ideal candidate brings deep expertise in thermal, mechanical, and heat mitigation solutions for memory product. They demonstrate strong analytical and problem-solving skills. They have a proven record of delivering products from concept through high-volume manufacturing!

Performs design and development engineering assignments related to hardware products and systems including development of new products or updates to existing products. Work may encompass one or more areas of engineering including electronic design, mechanical design, or other related fields. Duties may include research, evaluation, development, and application of new processes and methods into products. May be responsible for establishing and conducting testing routines, developing or implementing project plans, budgets, and schedules, and documentation of work and results.

Responsibilities

Design, develop, test, validate, and release mechanical and thermal solutions for advanced electronic systems, modules, and emerging memory technologies.

Develop innovative cooling solutions, including heat spreaders, heatsinks, vapor chambers, heat pipes, and liquid cooling technologies.

Define mechanical, thermal, reliability, and manufacturability requirements to meet product performance, quality, and customer objectives.

Perform and lead thermal CFD and mechanical FEA analyses to optimize product performance, reliability, cost, and design efficiency.

Develop and implement validation strategies, including thermal characterization, shock and vibration testing, thermal cycling, humidity testing, DFMEA, derating analysis, and reliability assessments.

Drive design reviews, risk assessments, root cause investigations, and corrective actions throughout the product lifecycle.

Collaborate with electrical, package, PCB, system, manufacturing, and reliability teams to deliver optimized and manufacturable solutions while contributing to JEDEC and industry standards development.

Mentor engineers, establish engineering guidelines, serve as the mechanical and thermal domain expert across multiple programs, and champion AI-enabled engineering workflows to enhance simulation, design optimization, validation, and productivity.

Education & Experience Requirements

Bachelor’s or Master’s degree or equivalent experience in Mechanical Engineering with 7+ years of mechanical and thermal engineering experience, including 7+ years in the electronics, storage, or semiconductor industry.

Proven track record of architecting, developing, and delivering mechanical and thermal solutions for product development and customer applications.

Strong expertise in SolidWorks, thermal modeling, and CFD simulation tools such as ANSYS Icepak, Fluent, or similar platforms, including AI-enabled design and validation workflows.

Hands-on experience with thermal management technologies, including heatsinks, thermal interface materials, vapor chambers, heat pipes, and liquid cooling solutions, as well as thermal and mechanical testing, validation, and failure analysis.

Deep understanding of mechanical design principles, heat transfer, fluid dynamics, GD&T, tolerance analysis, DFM/DFA, product qualification methodologies, and demonstrated technical leadership across multi-functional teams.

Preferred Qualifications

Experience with DDR, LPDDR, PCIe, HBM, memory modules, storage subsystems, and AI accelerator platforms.

Solid understanding of JEDEC standards and data center/server hardware architectures.

Expertise in advanced thermal and cooling technologies for AI and high-performance computing (HPC) environments.

Familiarity with finite element analysis (FEA), mechanical reliability modeling, and product performance optimization.

Proven ability to collaborate with global suppliers and manufacturing partners, demonstrated by a history of innovation through patents, publications, or significant technical contributions.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.Com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here.

To learn more about Micron, please visit micron.Com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at or (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Worksite address

boise junction, ID, 83725, US

Who can apply

Review the original listing for work authorization, qualifications and employer requirements.

Explore related searches

Current related jobs

STRATEGIC SYSTEMS PROGRAMS (SSP)

USAJOBS

SLCM-N TESTING AND EVALUATION BRANCH ENGINEER

Washington Navy Yard, DC

$143,913.00 – $197,200.00 per yearfull time

This is a public notice flyer to notify interested applicants of anticipated vacancies. Applications will not be accepted through this flyer. Int…

Closing date 2026-10-20View job

Naval Sea Systems Command

USAJOBS

ENGINEER/SCIENTIST

Washington Navy Yard, DC

$143,913.00 – $197,200.00 per yearfull time

You will serve as an ENGINEER or SCIENTIST in the Naval Architecture & Engineering Department (80); Systems Engineering and Assessments Division …

Closing date 2026-10-19View job

Naval Sea Systems Command

USAJOBS

ENGINEER/SCIENTIST

Washington Navy Yard, DC

$143,913.00 – $197,200.00 per yearfull time

This position is part of the Warfare Centers Personnel Demonstration Project. The ND-5 pay band encompasses positions equivalent to GS-14 and GS-…

Closing date 2026-10-19View job

U.S. Pacific Fleet

USAJOBS

SUPERVISORY NUCLEAR ENGINEER

Bremerton, WA

$173,463.00 – $225,506.00 per yearfull time

You will serve as a Supervisory Nuclear Engineer for Code 230 in the Nuclear Engineering and Planning Department (NEPD) (Code 2330) of Puget Soun…

Closing date 2026-10-20View job

Space Systems Command

USAJOBS

S&E Workforce Development Specialist, SSC/S37

Los Angeles, CA

$104,349.00 – $161,313.00 per yearfull time

Do not email applications. To submit your resume for this Direct Hire opportunity click here. For additional information on other USSF direct hir…

Closing date 2026-10-21View job

Naval Sea Systems Command

USAJOBS

GENERAL ENGINEER

Dahlgren, VA

$143,913.00 – $197,200.00 per yearfull time

This is a public notice flyer to notify interested applicants of anticipated vacancies. Applications will not be accepted through this flyer. Int…

Closing date 2026-10-27View job