About this opportunity
Micron Technology, Inc lists this Memory Packaging Architect for Edge & Data Center AI opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology, Inc in Boise, ID is seeking a Product Development Engineer 5 - Hardware Engineering MTS to define next-generation memory packaging architectures and to drive cross‑stack optimization across silicon, package, board, and system.
You will work with silicon, system design teams and customers, apply AI‑based multi‑physics methods, and help shape long‑term packaging strategy for edge‑AI and data center memory products.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.