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Job description
Micron Technology is seeking a senior packaging pathfinding expert to drive next‑generation memory system architectures from datacenter to edge‑AI. You will define cross‑stack optimizations across silicon, package, board and system, guiding long‑term package technology direction and collaborating with customers to translate ideas into scalable products and roadmaps.
You will interface across package process tech, materials, electrical, thermo‑mechanical and system performance to influence
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.