About this opportunity
Computer Task Group, Inc. lists this Microelectronics Engineering Technician – Wire Bonding & Precision Assembly opportunity in san jose, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Microelectronics Engineering Technician – Wire Bonding & Precision AssemblyCTG is seeking to fill a Microelectronics Engineering Technician – Wire Bonding & Precision Assembly position for our client. Location: San Jose, CA Duration: 3 months Duties: Perform precision wire bonding, automated bonding, and microelectronic assembly operations. Operate and set up wire bonders, auto bonders, furnaces, loaders, and other specialized manufacturing equipment. Inspect SMT, PCB assemblies, box builds, electronic components, and microelectronic assemblies using microscopes and magnification tools. Perform First Article Inspection (FAI), IPC-610 inspections, lot sampling, pass/fail evaluations, and final product acceptance testing. Conduct process testing and validation, including temperature control, peel testing on IC components, and customer simulation testing. Verify Bills of Material (BOMs), engineering change notices, manufacturing processes, and production readiness requirements. Document inspection results, defects, process deviations, and quality findings in accordance with established procedures. Support failure analysis, root cause investigations, process audits, and continuous quality improvement activities. Ensure manufacturing and inspection activities comply with engineering specifications, quality standards, and process requirements. Skills: Wire Bonder and Auto Bonder operation Precision mechanical tools and instruments SMT and PCB assembly inspection AOI (Automated Optical Inspection) First Article Inspection (FAI) IPC-610 standards Microscope and magnification inspection Electronic component and microelectronics inspection Furnace setup, sintering, and loader machine operations Process testing and validation Peel testing on IC components Quality control and quality assurance Statistical and lot sampling techniques MES and manufacturing process documentation Defect detection, identification, and reporting Process verification, compliance, and auditing Experience: Minimum 5 years of experience working in a high-tech manufacturing environment, preferably in microelectronics, semiconductor, or medical device manufacturing. Hands-on experience operating high-precision mechanical tools and wire bonding equipment is preferred. Experience with precision assembly, inspection, quality verification, and manufacturing processes. Experience working with microscopes and other magnification tools for detailed component inspection. Ability to follow detailed manufacturing procedures, engineering specifications, and quality standards. Experience documenting inspection results and supporting failure analysis or root cause investigations. Education: Technical certification, associate degree, or coursework in electronics, microelectronics, manufacturing technology, or a related field is preferred. Excellent verbal and written English communication skills and the ability to interact professionally with a diverse group are required.
Worksite address
san jose, CA, 95112, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.