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Job description
Responsibilities
Define and explore advanced package architectures for future memory systems
Perform package‑level trade‑off studies across SI, PI, thermals, cost, and scalability
Create hands‑on package designs and models for early feasibility analysis
Run SI/PI and thermal simulations and translate results into architecture guidance
Define package requirements and act as extension architecture and engineering
Minimum Qualifications
Bachelor’s degree or equivalent practical experience in EE, ME, Materials, or related field
10+ years of hands‑on experience in package design or package‑level simulation
Strong experience with package SI modeling and analysis
Ability to independently build models and drive conclusions
Preferred Qualifications
Master’s degree in a related technical field
Experience supporting architecture or pre‑silicon exploration teams
Familiarity with system‑level co‑design across silicon, package, and board
Experience with multi‑die or heterogeneous integration
Salary: $177,000.00 - $387,000.00 a year
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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Worksite address
san jose, CA, 95199, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.