About this opportunity
Apple Inc. lists this Package Integration Engineer opportunity in san francisco, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
San Francisco Bay Area, California, United States Hardware
Looking for a senior level IC packaging engineer to develop exciting new products. You will be responsible providing Custom Silicon packaging solutions in a module/system for various consumer markets.
Description
In this fast-paced environment, your role is to interface between internal product/device design, quality, supply chain, and external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a proven track record.
Responsibilities
Define new package characteristics based on unique module and system level performance, cost, and footprint requirements.
Define package/packaging specifications.
Work with suppliers on package design, new material, new equipment selection and process/process flow development.
Perform initial proof of concept sample build, POR establishment, package and process qualification, reliability test, yield analysis and enhancement.
Coordinate with other packaging and cross-functional team members to comply with product development/ramp schedule.
Deliver package/packaging milestones on time.
Define packaging roadmap based on long term packaged product requirements.
Work closely and Manage suppliers' R&D activities.
Minimum Qualifications
BS and 10+ years of relevant industry experience.
Preferred Qualifications
M.S or Ph.D. degree in mechanical engineering, physics, materials science or similar disciplines with a minimum of 10 years of experience in IC packaging. AutoCAD, APD and multi-physics simulation knowledge is a plus.
Some hands‑on knowledge in Wafer Bumping, Manufacturing assembly processes; such as wafer back‑grind, wafer dicing, Flip Chip die attach (including multilayer thin die stacking), encapsulation/molding, under‑fill, ball attach, package singulation and Tape & Reel.
In‑depth knowledge in Wafer Level Chip Scale Packaging (RDL/Wafer Bumping & BEOL Assembly processes for Fan‑In & Fan‑Out designs).
Expert level knowledge of common reliability failure modes. Able to understand device physics and component/board level reliability testing.
Proven track record to bring a product/package from conceptual stage to development and to HVM environment.
Ability to construct Designs of Experiments and down‑select materials and processes.
Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at team meetings and executive review meetings.
Able to perform independent research and development work with minimal supervision.
Compensation and Benefits
At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation.
Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Equal Opportunity
Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.
Accessibility
At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.
Learn about accessibility in Apple’s workplace.
Learn about reasonable accommodations for job applicants.
Apple accepts applications to this posting on an ongoing basis.
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Worksite address
san francisco, CA, 94199, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.