About this opportunity
OpenAI lists this Packaging Reliability Engineer - AI HPC, Equity opportunity in san francisco, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
OpenAI is seeking an Advanced Packaging Reliability Engineer based in San Francisco to lead reliability engineering for advanced AI packages. In this role, you will assess and optimize package reliability, working closely with multi-functional teams to predict package behavior and improve overall robustness, while developing innovative testing methodologies.
Ideal candidates will have significant experience in semiconductor package reliability, thermal modeling, and demonstrate strong problem-solving skills. Competitive compensation ranges from $266K to $445K plus equity offerings.
#J-18808-Ljbffr
Worksite address
san francisco, CA, 94199, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.