About this opportunity
Micron Technology lists this Principal HBM Architecture & Circuit Design Engineer opportunity in represa, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
HBM Core-Die Architecture & Circuit Design EngineerOur vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.This role owns next-generation HBM core-die architecture and critical DRAM circuit design that directly impact bandwidth, power, area, thermal efficiency, and long-term reliability. The engineer will drive architecture definition, circuit feasibility, and Architecture Reference Design (ARD) development across advanced 3D-stacked HBM products. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.Key ResponsibilitiesOwn HBM core-die architecture including Bank/Bank-Group organization, array partitioning, datapath, refresh, and reliability featuresDrive critical DRAM circuit design and timing closure for row, column, sensing, and datapath pathsDevelop and optimize architecture solutions for bandwidth, power, area, thermal, and reliability trade-offsDefine and validate refresh, row-hammer mitigation, data-retention, and power-efficient operation schemesLead architecture feasibility studies using transistor-level simulation and physical implementation analysisDevelop HBM Architecture Reference Designs (ARD), including golden schematics, timing budgets, and verification methodologyCollaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams to drive end-to-end design executionSupport silicon bring-up, characterization, failure analysis, and architecture-to-design handoffQualificationsProven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent)Strong understanding of DRAM array architecture, row/column paths, sensing, datapath, refresh, and reliability mechanismsHands-on experience with SPICE-based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent)Ability to evaluate performance, power, area, thermal, and reliability trade-offsExperience driving architecture decisions and cross-functional technical executionStrong problem-solving and communication skillsThe US base salary range that Micron Technology estimates it could pay for this full-time position is:$150,000.00 - $308,000.00 a yearAdditional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
Worksite address
represa, CA, 95671, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.