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Job description
Micron Technology is seeking a highly experienced Mechanical & Thermal Engineer to lead the mechanical and thermal architecture of advanced memory and AI computing platforms. You will design, test, and optimize cooling solutions, heat spreaders, heatsinks, vapor chambers, and liquid cooling, working across hardware teams to deliver reliable products from concept to high-volume manufacturing.
The role requires strong expertise in solid mechanics, CFD/FEA, and AI-enabled design workflows, with
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.