About this opportunity
Micron Technology, Inc lists this Principal Process Engineer, Die Bonding opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Principal Process Engineer – Die Bonding
As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.
Responsibilities
Develop, diagnose, and resolve various die bonding process technologies
Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step
Lead and participate in continuous yield improvement and cost reduction activities
Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives
Support SPC/FDC/RMS/APC and site-to-site portability
Support internal and external audits
Minimum Qualifications
A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering
Solid engineering knowledge of semiconductor advanced packaging die stacking processes
Skilled at designing valid tests and Design of Experiments (DOE)
Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs
Excellent oral and written communication skills and a strong attention to detail
Highly self‑motivated and have the ability to work independently, as a group leader, and as a collaborative contributor
Knowledge and an understanding of project management
Preferred Qualifications
Masters or Doctorate degree in Engineering, Physics, or related field
Experience in working on Die Bonding: Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration
Bonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or Integrator
Job Profile(s)
Semiconductor Process Engineer 5
Relocation Level: TBD
Benefits
Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays.
Equal Opportunity Employer
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.