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Broadcom Inc.

Process and Integration Engineer, Optoelectronics

upper macungie township, PA

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About this opportunity

Broadcom Inc. lists this Process and Integration Engineer, Optoelectronics opportunity in upper macungie township, Pennsylvania. Review the employer’s description below for duties, qualifications and application requirements.

Job description

Process and Integration Engineer – Optoelectronics

We are seeking a highly skilled Process Integration Engineer to join our Optical Systems Division. This position is pivotal to the efficient and profitable manufacturing of microelectronic laser and detector products in a 100% on‑site, 24/7 production environment. The successful candidate will serve as the technical authority for the facet coating process, driving improvements in productivity, yield, quality, and reliability across internal operations and subcontractor facilities while collaborating cross‑functionally to meet critical production commitments.

Responsibilities

Process Engineering & Optimization Lead the development, optimization, and scaling of complex multilayer coatings (AR, HR, and passivation layers) using Ion Beam Sputtering (IBS).

Design and execute experiments (DOE) to improve manufacturing efficiency and optimize batch processes.

Technical Leadership & Operations Serve as the technical lead for facet coating and backend operations, including wafer scribing, laser bar handling, and Automated Visual Inspection (AVI).

Manage equipment lifecycles, from defining requirements for new tool acquisitions to leading the qualification and buy‑off of engineering upgrades.

Quality & Data Analysis Implement robust process control plans, SPC, FMEA, and OCAP.

Utilize spectroscopic ellipsometry, spectrophotometry, and AFM for metrology.

Conduct deep‑diving root‑cause analyses and implement corrective and preventive actions (CAPA) to mitigate defects and process excursions.

Strategic Collaboration Partner with internal Product, Quality, and R&D teams, as well as external foundries, to align technical goals.

Manage subcontractor performance across regions via remote monitoring and maintain SOPs and technical documentation.

Reporting Establish KPIs and dashboards to monitor daily performance, cycle times, and process health; communicate findings through periodic reports to management.

Qualifications and Skills

Education Master’s degree in Materials Science, or Optical, Chemical, or Electrical Engineering.

Experience Minimum of 6 years of experience in semiconductor manufacturing, with at least 4 years of hands‑on experience in thin‑film deposition, specifically for optoelectronic devices.

Technical Proficiency Solid understanding of vacuum physics and deposition techniques (IBS, ALD) and dielectric coating materials (e.g., Al₂O₃, SiO₂, Ta₂O₅, TiO₂, Si₃N₄).

Analytical Skills Strong background in statistical data analysis; proficiency with SPC, DOE, FMEA, DMAIC, and advanced tools such as JMP, SQL, and Tableau.

Operational Knowledge Experience with automated bar‑handling, wafer scribing and cleaving, Pick‑and‑Place (PnP), AVI tools, Burn‑in, and mechanical engineering fundamentals.

Soft Skills Excellent written and verbal communication, detail‑oriented problem‑solving capabilities, and a proactive, action‑oriented mindset.

Preferred Ph.D. in Materials Science, or Optical, Chemical, or Electrical Engineering with at least 3 years of experience in semiconductor manufacturing.

Proven knowledge and practical application of Lean manufacturing methodologies.

About the Facility

The Breinigsville, PA, manufacturing location was created by AT&T in the late 1980s as Bell Laboratories’ world headquarters for optoelectronics. Through a series of acquisitions, this facility is now an integral part of Broadcom’s Optical Systems Division, manufacturing indium phosphide lasers and detectors that support telecommunications and datacenter customers worldwide. Located in the Lehigh Valley region of Pennsylvania just outside Allentown, the high‑volume, 24/7 facility fabricates devices that enable fiber‑optic communication and datacenter expansion.

Compensation and Benefits

Annual base salary range: $109,700 – $175,500.

Discretionary annual bonus and an equity grant, plus annual equity awards.

Medical, dental, and vision plans.

401(k) participation with company matching.

Employee Stock Purchase Program (ESPP).

Employee Assistance Program (EAP).

Company‑paid holidays, paid sick leave, and vacation time.

Paid Family Leave and other leaves of absence in compliance with applicable laws.

Equal Opportunity Employer

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside the USA, please be sure to provide a home address as this will be used for future correspondence.

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