About this opportunity
Arizona State University lists this Senior 300mm Wafer Packaging Engineer opportunity in tempe, Arizona. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Arizona State University is seeking a Senior Process Engineer for the Advanced Electronics and Packaging Core Facility in Tempe. The role focuses on wafer prep and finishing, including die attach, molding, grinding, wafer saw, and ball drop/reflow, with development on 300mm tooling and ownership of dicing saw and wafer grinders.
Working with device physics, deposition, etching, photolithography, and electrical test, you will ensure robust packaging processes, improve yields, and support
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Worksite address
tempe, AZ, 85285, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.