About this opportunity
GlobalFoundries lists this Senior 3D/2.5D Packaging Engineer – Interposer & Bridge opportunity in essex, Maryland. Review the employer’s description below for duties, qualifications and application requirements.
Job description
A leading semiconductor foundry in the United States is seeking a Senior 3D Heterogeneous Integration Engineer to manage end-to-end integration for advanced packaging technologies. The successful candidate will have extensive experience in chiplet-based integration and will work closely with cross-functional teams. A Master's degree and a minimum of 10 years of related engineering experience is required, with a salary range of $118,000.00 - $210,000.00 depending on experience. This technical role promotes innovation in a fast-paced environment.
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Worksite address
essex, MD, 21221, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.