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Job description
GlobalFoundries is seeking an experienced R&D engineer to lead advanced 3D Heterogeneous Integration initiatives in the Advanced Packaging Lab. You will drive BEOL process development, bonding, TSVs, and wafer-to-wafer integration while partnering with process and manufacturing teams.
You will guide project teams, analyze data, and address failure modes to enable new capabilities and early prototyping across programs in a large-scale semiconductor environment.
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Worksite address
essex junction, VT, 05453, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.