About this opportunity
Micron Technology, Inc lists this Senior Chip-to-Wafer & Hybrid Bonding Lead opportunity in boise, Idaho. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Micron Technology, Inc in Boise, Idaho is seeking a Senior Process Engineering Technical Leader focusing on chip-to-wafer and hybrid bonding. The ideal candidate will lead the development and scale-up of bonding processes for high-performance 3D memory products, collaborating across various teams to ensure repeatability and readiness for high-volume manufacturing.
Requirements include a Master’s degree or PhD in a relevant field, along with 13+ years of experience in semiconductor R&D, specifically in advanced packaging. Micron offers comprehensive benefits including medical plans and paid family leave.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.