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Job description
A leading semiconductor company in Boise, ID, is seeking a Principal Diffusion Process Development Engineer to lead the advancement of FEOL diffusion processes for advanced DRAM technologies. The ideal candidate will have a PhD and a strong background in device physics and process scaling. You will drive innovations and collaborate with cross-functional teams to ensure the execution of the latest technologies. A competitive benefits package and a culture that values personal wellbeing and professional growth await the right candidate.
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Worksite address
boise, ID, 83708, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.