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Job description
Proven history of architecting complex digital hardware.
Knowledge of board level digital design process from schematic capture, implementation, integration, and verification.
Experience designing with Gigahertz microprocessors, FPGA, CPLD, DDR4 memory, flash memory.
Experience with large pin count devices, 1000+ pins with 0.8mm device pitch or smaller
Experience in High Density Interconnect (HDI) technologies (micro vias, buried / blind vias, back drilling) for IPC Class 3 board.
Experience in design of 5+ Gbps serial links. (10GBASE-KR, PCIe Gen3, Fiber Optics)
Experience designing with CAN, MIL-STD-1553, ARINC 429, ARINC 664, TSN.
Experience with OpenVPX and PIC-SIG standards.
Experience in the Mil/Aero/avionics, DO-254 and Civil FFA Certification.
Strong professional technical writing and technical communication proficiency.
Ability to break down complex problems and apply critical thinking.
Familiarity with the Mentor Graphics Expedition Enterprise and Hyperlinx PI/SI.
Familiarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, Microsoft Visio.
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Worksite address
melbourne, FL, 32935, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.