About this opportunity
Siemens AG lists this Senior Director, Technical Business Development - 3DIC & Advanced Packaging opportunity in boulder, Colorado. Review the employer’s description below for duties, qualifications and application requirements.
Job description
Position Overview
Siemens Digital Industries Software seeks a proven and motivated individual to lead the Technology Solutions Sales organization for 3DIC and Advanced Packaging.
3DIC is one of the most strategically important and fast-moving areas in the semiconductor industry. Siemens has established early customer relationships and pilots, and what’s needed now is a leader who can convert that early momentum into a repeatable, scalable new business engine — while building the internal alignment and best practices to sustain it.
This role is as much about internal leadership as external selling. You will partner closely with regional Sales, Technical Sales, and Portfolio Unit teams to surface opportunities, align on go-to-market strategies, and drive 3DIC growth.
Responsibilities
Own and lead the strategy to identify, develop, and close net-new 3DIC and advanced packaging business opportunities in partnership with regional Sales and Technical Sales leaders
Build repeatable approaches to opportunity development and closure — creating best practices for the broader team
Act as the primary connector across Sales, Technical Sales, and Portfolio Unit teams — building the alignment needed to move opportunities forward
Partner with Portfolio Unit and R&D teams to ensure field insights feed into product strategy and the field has what it needs to win
Support new business development for our Electronic Board Systems (EBS) business unit
Lead and develop a high-performing team of Account Technology Managers (ATMs), coaching on territory planning and new business growth
Define and manage sales territories annually, contributing to multi-year global growth plans for 3DIC
Partner with marketing to design and execute campaigns, seminars, and webinars that generate new 3DIC leads and build market awareness
Qualifications
Bachelor's degree in Electrical Engineering or Computer Science and 12+ years' experience in EDA, semiconductor design, or electronics industries
Deep knowledge of 3DIC and advanced packaging strongly preferred
Familiarity with Electronic Board Systems and the broader EDA landscape an advantage
Proven ability to build collaborative momentum across Sales, Technical Sales, and Portfolio teams in a matrixed environment
Track record of creating structure and best practices in ambiguous, fast-moving environments while delivering near-term results
Demonstrated success leading technical sales teams and converting emerging market opportunities into new business
Strong prospecting, demand creation, and negotiation skills
Executive-level communication and influencing skills, internally and externally
Comfortable operating with ambiguity and driving progress when the playbook is still being defined
Working Conditions
30%+ travel required
Preferred location: North America, near a major airport
Why us?
Working at Siemens Software means flexibility - Choosing between working at home and the office at other times is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software.
A collection of over 377,000 minds building the future, one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow!
Siemens Software.
Transform the Everyday
#LI-EDA
#LI-HYBRID
$274,700 $549,400 30%
Organization: Digital Industries
Job Type: Full-time
Category: Sales
#J-18808-Ljbffr
Worksite address
boulder, CO, 80301, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.