About this opportunity
APIC CORPORATION lists this Senior Electro Optics Packaging Engineer opportunity in culver city, California. Review the employer’s description below for duties, qualifications and application requirements.
Job description
APIC Corporation—an industry pioneer in advanced photonics since 1999—is shaping the future of high‑performance computing and AI. Our Heterogeneously Integrated Photonics and Electronics (HIP‑E) platform fuses photonically connected chiplets with next‑generation advanced packaging to deliver unmatched bandwidth, energy efficiency, and low‑latency interconnects for dual‑use commercial and defense systems. For more information, refer to our website:
We’re expanding our engineering team with a Senior Electro‑Optics Packaging Engineer who will lead the mechanical development of next‑generation integrated optical modules.
If you thrive at the intersection of precision engineering, advanced materials, and mission‑critical reliability , this role puts you at the center of breakthrough innovation.
What You’ll Do
Lead mechanical and opto‑mechanical design of compact, high‑performance EO modules
Architect packaging solutions for optoelectronic and IC assemblies (fiber alignment, wire bonding, flip‑chip, 3D packaging)
Perform structural, thermal, and coupled‑physics simulations using ANSYS, COMSOL, and SolidWorks
Ensure micro‑radian alignment stability under dynamic thermal, shock, and vibration environments
Conduct material property analysis, yield improvement, and failure‑mode investigations
Collaborate with photonics, electronics, reliability, and manufacturing teams to deliver production‑ready hardware
Ensure compliance with JEDEC, EIA, Telcordia, and MIL‑STD requirements
What You Bring
10+ years in optical, optoelectronic, or IC packaging and assembly
Expertise in optical bench design and precision alignment systems
Hands‑on experience with fiber alignment tools, wire bonding, flip‑chip bonding, and fiber packaging
Strong background in microelectronics, optoelectronics packaging, and low‑outgassing adhesive systems
Proficiency with SolidWorks and FEA tools (ANSYS required)
Knowledge of materials, multilayer interfaces, BGA/PCBA/Flex reliability, and 3D packaging
Familiarity with DOE, SPC, Six Sigma, and reliability engineering methodologies
U.S. Citizenship or Permanent Residency (ITAR‑restricted programs)
Education
BS in Mechanical Engineering, Electrical Engineering, Physics, Applied Physics, or related field
MS or PhD preferred
Why APIC
Work on breakthrough photonic‑enabled compute architectures
Contribute to dual‑use technologies with national‑security impact
Competitive compensation and comprehensive benefits
Los Angeles, CA • $115,000.00 - $130,000.00
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Worksite address
culver city, CA, 90232, US
Who can apply
Review the original listing for work authorization, qualifications and employer requirements.